EE 509 Mixed-Signal IC Testing and Built-In-Self-Test

 

Spring 2022

Class Time:   MWF 2:10-3:00 pm;

Class Room: 1332 Howe Hall  

Lecture Instructor:

Degang Chen, 2134 Coover Hall

Office Hour: MWF 3:00 - 4:00 pm

Voice: (515)294-6277, Fax : (515)294-8432

e-mail: djchen@iastate.edu,  

 

Homework Assignments

·       See inside the slides

Lecture Notes

·       Introduction; intro to packaging

·        

·       DACStandardTest

·       ADCModel;

·       ADCStandardTest;

·        

·       Measurement basics

·       maximum likelihood estimate

·       SATOM paper; presentation;

·       Least square method

·        

·       DC and Parametric Tests; Book Chapter 3 problems

·       Data Analysis

·       Analog Channel Testing

·       Sampled Channel Testing

·       test circuitry and signal conditioning

·       DIB design

·            

·       Le Jin’s SEIR paper; Nonstationary; Presentation

·       uSMILE paper;Presentation1;

·       ITC2005; NCslides; comparison paper

·       FIRE; FIRESlides; FERARI; FERARISlides

·       Multi-tone Sine Wave with minimum PAPR

·        

·       DAC_Testing_I2MTC; draft_presentation;

·       DAC testing ITC paper; ITC presentation

·       USER-SMILE; TCAS; ITC; Presentation;

·        

·       BIST circuit, phase control, ramp+shift,

·       DfT

·       Analog verification

·       Fundamentals of RF Testing

·       RF Test Methods

 

Reading Materials

·       IEEE 1057-2017 Approved Draft Standard for Digitizing Waveform Recorders

·       IEEE 1241-2011 Standard for Terminology and Test Methods for Analog-to-Digital Converters

·       Analog Device’s Data Conversion Handbook: Chapter 5 pdfMark Baker (Author)

·        

 

Course Description:

From Catalog:

E E 509 Mixed-Signal IC testing and Built-In-Self-Test. (3-0) Cr. 3. Prereq: knowledge in signal processing (E E 424) and data converters (E E 435 or E E 505). Introduction to mixed-signal IC testing; measurement uncertainty and test validity; IEEE standard test algorithms; high performance test and built-in self-test (BIST) challenges; new mixed-signal test algorithms and techniques to reduce data acquisition, to relax instrumentation requirements, to simplify test setup, to improve test validity, and/or to enable co-testing of heterogeneous functions.

 

From an email sent to students:

 

Prerequisites for EE509 are at undergrad level and are listed below:

·       Efficiency in Matlab programming

·       Knowledge of signal processing (as in EE424, especially Fourier transform, DFT/FFT)

·       Knowledge of data converter operation (as in EE230, or EE435, or EE505)

·       Knowledge of probability, statistics, orthogonality, vectors, matrices.

 

Currently, the COB (cost of build) of integrated circuit chips is, on the average, roughly 1/3 die cost, 1/3 package cost, and 1/3 production test cost. For high performance analog and mixed-signal ICs, such as high resolution data converters, test cost can be as high as 70 to 90% of COB or even higher in special cases. As die cost continues to reduce with technology scaling, the pressure to keep the test cost down while maintaining or improving test accuracy is mounting. This is one of the grand challenges facing the future semiconductor industry as identified by the International Technology Roadmap for Semiconductors (ITRS).

 

We will introduce the current state and challenges in mixed-signal testing and BIST. Statistical signal processing and system identification techniques applicable to AMS test will be introduced. Recently developed algorithms that dramatically simplify AMS test will be presented. On-chip implementation techniques and issues will be described. Several new ideas for dramatically reducing test cost and uncertainty will be explored. These could potentially lead to multiple conference and/or journal publications by students.

 

Homework and exams:

There will be weekly HW assignments, with a combination of problems involving theoretical derivation, hand computation, Matlab programming, and computer based analysis of measurement data. Handwritten HW solutions for the first two types of problems are acceptable, but you are encouraged to submit HW electronically in MSword.

For an average student expecting an average grade, I expect you to spend 6-8 hours a week on your HW. If an assignment is taking too much time, please let me know and I'll make adjustments to the assignments and/or change the due time.

There will be one midterm exam and one final exam. Whether the exams will be take-home or in-class, open-book or closed-book will be determined based on student input. But at least one of the exams will be in-class. For the final exam time, check the university web page for schedule of final exams. The time for the midterm exam will be decided in class.

You are encouraged to discuss with each other for HW problems but you are required to submit your individual work. I'll let you have the email addresses of all of your classmates. It's up to you to find partners if you so choose. However, the exams will be for individual work. You cannot consult with any person other than me for your exams, not your classmates, not your colleagues, not your family members, not other professors.

We will also have projects for students to choose. The project choices will be described in class during the first week. Two students per project are recommended. If a student so chooses, he/she can partner with a graduate student who had taken EE509 before.

Grading:

·       Homework: 20%

·       Midterm Exam: 20%          

·       Final Exam: 40%

·       Project: 20%

 

Attendance:

·       Attendance is not required but strongly recommended. No attendance will be taken during class.

·       You are responsible for all course materials, announcements, notes, etc. made during our regular class meeting times.

·       Arrival to classroom before 2:10 is appreciated.

·       If you have to leave early, you should let me know beforehand.

·       During class time, you should be only doing or talking about things related to the class.

 

Classroom Behavior:

·       You are encouraged to ask specific questions related to the lecture material as well as more general questions related to the course topics.

·       You are encouraged to answer questions that I pose or questions that your classmates ask. Do not be concerned about the correctness of your answers. Your participation can only positively affect your grades.

·       Please turn off your cell phone before the class. Letting your cell phone ring in the classroom, or answering your phone during class time, or walking out to answer a phone will negatively affect your grade. (Example exception would be: you let me know before class that you are expecting an important call and you put your phone in silent mode.)

·       All activities prohibited by laws or discouraged by university rules are not allowed in the classroom, such as smoking and alcohol drinking. Snacks and water drinking are OK as long as you do not disturb the class.

·       Comments that are of racial discrimination, sexual discrimination, religious discrimination, or other hurtful nature are prohibited.

 

Academic Honesty:

It is the responsibility of the instructor to encourage an environment where you can learn and your accomplishments will be rewarded fairly. Any behavior that compromises the basic rules of academic honesty as described in the General Catalog will not be tolerated.

 

Americans with Disabilities Policy Statement

The Americans with Disabilities Act (ADA) is a federal anti-discrimination statute that provides comprehensive civil rights protection for persons with disabilities. Among other things, this legislation requires that all students with disabilities be guaranteed a learning environment that provides for reasonable accommodation of their disabilities. If you believe you have a disability requiring an accommodation, please first contact the appropriate university offices for guidance and evaluation and then contact me privately in my office.

 

Reference sources for course materials:

https://images-na.ssl-images-amazon.com/images/I/51m8MoT6GML._SX403_BO1,204,203,200_.jpgRoberts

 

https://images-na.ssl-images-amazon.com/images/I/511CEnVC2iL._SX347_BO1,204,203,200_.jpgAnalog Devices Inc. Engineeri , Data Conversion Handbook (Analog Devices)  (December 16, 2004)

·       Analog Device’s Data Conversion Handbook: Chapter 5 pdfMark Baker (Author)

https://images-na.ssl-images-amazon.com/images/I/51my2dcqXRL._SX371_BO1,204,203,200_.jpgKay

https://images-na.ssl-images-amazon.com/images/I/51A11NP1T2L._SX370_BO1,204,203,200_.jpgKay

https://images-na.ssl-images-amazon.com/images/I/41LM2R0e8EL._SX383_BO1,204,203,200_.jpgChapter 7, Boyd

https://images-na.ssl-images-amazon.com/images/I/51jBmMQp8FL._SX368_BO1,204,203,200_.jpgJohansson

https://images-na.ssl-images-amazon.com/images/I/41hnX3%2B52YL._SX327_BO1,204,203,200_.jpgWambacq and Sansen Visit Amazon's Mark Baker Page

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